MS Sci & Engineering 10/25

In MS Science/Engineering this week, we had a fun time jumping into our “Ship the Chip” project (in which students have to design packaging to sustain a single potato chip through the mail). Everyone was productive during our build day, and we learned a lot about 3d box design and the fundamentals of collision forces and impulse.


Simultaneously, we continued to learn about elastic and ductile forces within the earth and how they pertain to earthquakes and tectonic movement. We took some time to discuss the correlations between their project and these geological concepts.


Lastly, the students continued to research their science fair topics, aggregating the initial 5 sources for their research plans.


Izzy presented an awesome Master Class describing her experiences in wakeboarding and wakesurfing.


Check out the pics in the gallery below!




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